Prof.Rongmei Chen | 陈荣梅教授
Prof.Rongmei Chen is an assistant professor at the Research Center for Carbon-based Electronics, Peking University.
The main research areas of Prof. Chen Rongmei are carbon-nanotube integrated circuits, three-dimensional integrated circuits, DTCO/STCO based on advanced semiconductor technology, and large-scale digital chip design. More than 60 journals and conference papers have been published, including Nature Electronics, IEEE series and other journals, as well as three top-level conferences on microelectronics and integrated circuits, namely IEDM/VLSI/ISSCC. The research results have received attention from top universities and semiconductor companies such as Stanford University, TSMC, Intel, Google, Qualcomm, and Huawei, who invited Prof. Chen to give reports. Multiple highlights and interviews are received from the European Microelectronics Research Center, mainstream European technology media, and IEEE Spectrum magazine. Prof. Chen hosted the VLSI 2021 3D Integration Technology Seminar, convened the VLSI 2023 Chip Backside Interconnection Technology Seminar, and served as a reviewer and an invited commentator for the Nature Electronics. He has won many honors such as the China National Overseas High Level Youth Talent Program, the EU Marie Curie funded project (ranking 7/1000 for global engineering applicants), the technical highlights of VLSI 2022 Conference, the top ten innovative technologies in China's radiation physics field (based on doctoral projects) in 2015-2017, and the excellent doctoral dissertation of Tsinghua University.
Education Experience
2012/09 - 2017/07 Doctoral Student, at Department of Engineering Physics, Tsinghua University.
Major in integrated circuits / nuclear science and technology
2014/11 - 2015/11 Joint Doctoral Student / Visiting Scholar, at Department of Electronic Engineering and Computer Science, Vanderbilt University, United States
2008/08 - 2012/07 Bachelor, at Department of Engineering Physics, Tsinghua University.
Major in Engineering Physics
Work Experience
2023/07 - Present Assistant Professor, at School of Electronics, Peking University
2019/04 - 2023/06 Long-term Researcher, at Interuniversity Microelectronics Centre (IMEC).
Honored Marie Curie Scholar by EU
2017/09 - 2019/03 Postdoctoral Fellow, at LIRMM Laboratory of the French National Academy of Sciences
Academic Job
▣ Reviewer of Microelectronics Reliability (Excellent Reviewer Award), Microelectronics Journal (Excellent Reviewer Award), Nature Electronics (Invited as commentator), IEEE Transactions on Nuclear Science, IEEE Transactions on Computer Aided Design, IEEE Transactions on Electron Device, IEEE VLSI, IEEE Transactions on Components, Packaging and Manufacturing Technology, etc.
▣ TPC (Technical Program Committee) / Reviewer / Session Chair of IEEE conference including NSREC, VLSI-SOC, EDTM, ICTA, etc
▣ Convener and Organizer of Symposia on VLSI Technology and Circuits 2021 Workshop (3D Integrated Circuits), inviting delegates from CADENCE, ARM, QUALCOMM, SK Hynix, CEA-Leti to participate in discussion
▣ Convener and Organizer of Symposia on VLSI Technology and Circuits 2023 Workshop (Chip Backside Interconnection Technology), inviting delegates from leading companies of Chip Backside Interconnection Technology, including CADENCE, ARM, Google, ASML, Georgia Tech, Synopsys, Intel to participate
