Faculty | 教职
Prof.Rongmei Chen | 陈荣梅教授
Prof.Rongmei Chen is an assistant professor at the Research Center for Carbon-based Electronics, Peking University.
The main research areas of Prof. Chen Rongmei are carbon-nanotube integrated circuits, three-dimensional integrated circuits, DTCO/STCO based on advanced semiconductor technology, and large-scale digital chip design. More than 60 journals and conference papers have been published, including Nature Electronics, IEEE series and other journals, as well as three top-level conferences on microelectronics and integrated circuits, namely IEDM/VLSI/ISSCC. The research results have received attention from top universities and semiconductor companies such as Stanford University, TSMC, Intel, Google, Qualcomm, and Huawei, who invited Prof. Chen to give reports. Multiple highlights and interviews are received from the European Microelectronics Research Center, mainstream European technology media, and IEEE Spectrum magazine. Prof. Chen hosted the VLSI 2021 3D Integration Technology Seminar, convened the VLSI 2023 Chip Backside Interconnection Technology Seminar, and served as a reviewer and an invited commentator for the Nature Electronics. He has won many honors such as the China National Overseas High Level Youth Talent Program, the EU Marie Curie funded project (ranking 7/1000 for global engineering applicants), the technical highlights of VLSI 2022 Conference, the top ten innovative technologies in China's radiation physics field (based on doctoral projects) in 2015-2017, and the excellent doctoral dissertation of Tsinghua University.
Education Experience
2012/09 - 2017/07 Doctoral Student, at Department of Engineering Physics, Tsinghua University.
Major in integrated circuits / nuclear science and technology
2014/11 - 2015/11 Joint Doctoral Student / Visiting Scholar, at Department of Electronic Engineering and Computer Science, Vanderbilt University, United States
2008/08 - 2012/07 Bachelor, at Department of Engineering Physics, Tsinghua University.
Major in Engineering Physics
Work Experience
2023/07 - Present Assistant Professor, at School of Electronics, Peking University
2019/04 - 2023/06 Long-term Researcher, at Interuniversity Microelectronics Centre (IMEC).
Honored Marie Curie Scholar by EU
2017/09 - 2019/03 Postdoctoral Fellow, at LIRMM Laboratory of the French National Academy of Sciences
Academic Job
▣ Reviewer of Microelectronics Reliability (Excellent Reviewer Award), Microelectronics Journal (Excellent Reviewer Award), Nature Electronics (Invited as commentator), IEEE Transactions on Nuclear Science, IEEE Transactions on Computer Aided Design, IEEE Transactions on Electron Device, IEEE VLSI, IEEE Transactions on Components, Packaging and Manufacturing Technology, etc.
▣ TPC (Technical Program Committee) / Reviewer / Session Chair of IEEE conference including NSREC, VLSI-SOC, EDTM, ICTA, etc
▣ Convener and Organizer of Symposia on VLSI Technology and Circuits 2021 Workshop (3D Integrated Circuits), inviting delegates from CADENCE, ARM, QUALCOMM, SK Hynix, CEA-Leti to participate in discussion
▣ Convener and Organizer of Symposia on VLSI Technology and Circuits 2023 Workshop (Chip Backside Interconnection Technology), inviting delegates from leading companies of Chip Backside Interconnection Technology, including CADENCE, ARM, Google, ASML, Georgia Tech, Synopsys, Intel to participate
Students | 学生
Linqiu Wang | 王林秋
Linqiu Wang is a doctoral student, major in Physics Electronics at the School of Electronics, Peking University.
During Wang's tenure at Alibaba, she was mainly responsible for the full process development of physical design for ultra-low power IoT chips on the 12nm platform. She used Innovus+PrimeTime to complete place, clock tree, route, and power. She was also responsible for optimizing the overall physical design flow and library for multiple projects, communicating and collaborating closely with the front-end design team to maximize energy efficiency and complete time series analysis and convergence. Power&preference&area was optimized while meeting requirementschip of physical design. During her PIE internship experience, she participated in the design and improvement of the 0.15um OTP device process flow. She completed the process failure and analysis of 0.15um OTP devices, tested the correlation between the BPSG thickness of ILD layer and crosstalk failure in 0.15um OTP devices and tested the correlation between the Spacer layout size of 0.15um OTP devices and crosstalk failure issues.
Education Experience
2023/09 - Present Doctoral Student, at School of Electronics, Peking University.
Major in Physics Electronics
2017/09 - 2020/07 Master, at School of Software and Microelectronics, Peking University.
Major in Integrated Circuit Engineering
2012/09 - 2016/07 Bachelor, at School of Information and Communication Engineering, Hainan Unversity.
Major in Communication Engineering
Work Experience
2020/08 - 2023/03 R&D Engineer, at Alibaba T-head Semiconductor Co., Ltd
2018/08 - 2019/03 PIE Intern, at China Resources Microelectronics Semiconductor Co., Ltd
Tianchi Liu | 刘天驰
Tianchi Liu is an undergraduate student, major in Communication Engineering at Yingcai Honors College, Unversity of Electronic Science and Technology of China (UESTC).
During his undergraduate studies, Liu's main research field was digital circuit design, including digital computation in memory (CIM) and computing architecture design. During his junior year, he published a paper as the first author at the flagship conference in the field of communication circuits, The IEEE International Symposium on Circuits and Systems (ISCAS). His related work has received attention from researchers at home and abroad. Liu achieved excellent grades during his undergraduate studies. In his freshman year, he was transferred to the Yingcai Experimental College with the first grade in the School of Information and Communication Engineering. In his sophomore year, he ranked 1/83 comprehensively and was awarded the Wuliangye Academic Scholarship.
Education Experience
2020/09 - Present Undergraduate Student, at Yingcai Honors College, Unversity of Electronic Science and Technology of China.
Major in Communication Engineering
Canyang Yang | 杨粲旸
Canyang Yang is a master student, major in Electronic Information at the School of Physics and Optoelectronics, Xiangtan University.
During his work at AVIC Landing Gear Company, Yang was mainly responsible for product mechanics, environmental and durability test design, and participated in multiple patented inventions and key product test designs in the department team.
Education Experience
2023/09 - Present Master Student, at the School of Physics and Optoelectronics, Xiangtan University.
Major in Electronic Information
2015/09 - 2019/07 Bachelor, at School of Instrument Science and Engineering, Harbin Institute of Technology.
Major in Measurement, Control Technology and Instruments
Work Experience
2020/07 - 2022/05 Test Designer, at AVIC Aircraft Landing Gear Co., Ltd. Changsha Branch
Feifan Xie | 谢飞帆
Feifan Xie is a doctoral student at Purdue University West Lafayette.
Xie's research interests and work experience mainly focus on the fields of fluids and heat transfer, including engineering fluid thermal simulation calculations and experimental fluid mechanics. His current work focuses on microchip scale heat transfer analysis and chip packaging cooling technology.
Education Experience
2023/09 - Present Doctoral Student, Purdue University West Lafayette.
Major in Mechanical Engineering
2022/01 - 2022/05 Exchange, University of Illinois Urbana Champagne Campus.
Major in Mechanical Engineering
2019/09 - 2023/07 Bachelor, at Zhejiang University.
Major in Mechanical Engineering
Work Experience
2023/09 - Present Research Assistant, at Peking University
2022/05 - 2022/08 Research Assistant, at Johns Hopkins University Whiting Institute of Technology
2021/02 - 2021/06 Laboratory Assistant, at Innovation Laboratory of Zhejiang University
2021/01 - 2022/09 Research Assistant, at Zhejiang University