The main research areas of Prof.Chen are carbon-nanotube integrated circuits, three-dimensional integrated circuits, DTCO/STCO based on advanced semiconductor technology, and large-scale digital chip design. More than 60 journals and conference papers have been published, including Nature Electronics, IEEE series and other journals, as well as three top-level conferences on microelectronics and integrated circuits, namely IEDM/VLSI/ISSCC. The research results have received attention from top universities and semiconductor companies such as Stanford University, TSMC, Intel, Google, Qualcomm, and Huawei, who invited Prof. Chen to give reports. Multiple highlights and interviews are received from the European Microelectronics Research Center, mainstream European technology media, and IEEE Spectrum magazine. Prof. Chen hosted the VLSI 2021 3D Integration Technology Seminar, convened the VLSI 2023 Chip Backside Interconnection Technology Seminar, and served as a reviewer and an invited commentator for the Nature Electronics. He has won many honors such as the China National Overseas High Level Youth Talent Program, the EU Marie Curie funded project (ranking 7/1000 for global engineering applicants), the technical highlights of VLSI 2022 Conference, the top ten innovative technologies in China's radiation physics field (based on doctoral projects) in 2015-2017, and the excellent doctoral dissertation of Tsinghua University.

Recruitment requirements for doctoral and postdoctoral students: Aspired and highly motivated to research; Major in the fields of integrated circuit design, both digital and analog, preferably with knowledge of semiconductor devices or solid state physics; Backgrounds in integrated circuits, chip design, chip fabrication, chip testing, and packaging. With interviews all year round, welcome to email for consultation to crm@pku.edu.cn. The email title states "Doctor (Postdoc) Consultation - Name - Current Organization".