Joint Postgradustes | 联合培养
Chenghan Wang | 王成晗
Chenghan Wang is a 2025-entry PhD student in the Department of Computer Science and Engineering at The Chinese University of Hong Kong. His current research focuses on 2.5D/3D advanced packaging, especially multi-physics simulation, numerical computing and hardware acceleration. During his time at the Institute of Microelectronics of the Chinese Academy of Sciences, he joined the development of multi-physics simulation tools for 2.5D and wafer-scale heterogeneous integration, responsible for thermal simulation, equivalent-material-parameter extraction and numerical solvers.
Education Experience
Aug 2025 - Present PhD Student, Department of Computer Science and Engineering, The Chinese University of Hong Kong
Sep 2021 - Jun 2024 Master Student, EDA Center, Institute of Microelectronics, Chinese Academy of Sciences
Sep 2017 - Jun 2021 Bachelor, School of Information Science and Engineering, Harbin Institute of Technology (Weihai)
Work Experience
Jul 2024 - Jun 2025 Assistant Engineer, Institute of Microelectronics, Chinese Academy of Sciences