Alumni | 校友
Xinheng Liu | 刘心承
Xincheng Liu, Master's student at Hunan University.
From March 2024 to March 2025, Xincheng Liu was jointly trained and exchanged at the School of Electronics, Peking University, during which he systematically learned advanced-node physical design methodologies, 3D-chip physical design techniques and process fundamentals, carried out preliminary exploration of carbon-silicon heterogeneous-integrated CPUs, and completed the full physical design of a 3D chip along with partial evaluation of its electrical characteristics.After graduation, he worked as a Senior Engineer at Cadence.