Alumni | 校友
Feifan Xie | 谢飞帆
Feifan Xie is currently pursuing a master's degree in University of Leuven, Belgium.
Xie's research interests and work experience mainly focus on the fields of fluids and heat transfer, including microchip scale heat transfer analysis and chip packaging cooling technology. He graduated from Zhejiang University with a bachelor's degree. From September 2023 to July 2024, he served as a research assistant in our research group, during which time he published first-author (co-author) articles in IEDM 2024 and ECTC 2024, etc.